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Bernoulli Chuck - List of Manufacturers, Suppliers, Companies and Products

Bernoulli Chuck Product List

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Bernoulli Chuck for Soft Contact Lenses

I will transport the wet soft contact lenses.

We transport water-containing soft contact lenses. The "soft contact lens transfer device" uses air ejection to create negative pressure through the ejector effect, Bernoulli effect, and Coanda effect for lens suction grip, and generates positive pressure through a pressure chamber air action effect to release the lens, balancing the gripping contact force to gently hold and transport the contact lenses. All operations are performed using the action of airflow, ensuring that the flexible contact lenses are transported without damage.

  • Other conveying machines
  • Conveyor
  • Transport and handling robots

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Bernoulli chuck (contact type)

Bernoulli chuck compatible with warped wafers and thin wafers.

This is a Bernoulli chuck that accommodates warped and thin wafers, offering excellent cost performance. It can be mounted on any type of robot in our atmospheric environment transport robots. We conduct verification using sample wafers and design to accommodate various sizes, warpage amounts, and wafer thicknesses based on the customer's desired shape. The Bernoulli effect is used to suction the workpiece against the substrate. To prevent shifting during transport, it is held in place by the frictional force of friction rubber. The chuck side makes contact, but it can be used interchangeably for different wafer sizes (note that this may not be possible depending on the combination), allowing for a thinner chuck compared to non-contact types. Since the suction is based on Bernoulli's principle, it applies force over a wider area than vacuum suction chucks, making it effective for thin wafers.

  • Other semiconductor manufacturing equipment

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Bernoulli chuck (non-contact type)

This is a Bernoulli chuck designed for warped wafers and thin wafers.

This is a Bernoulli chuck that accommodates warped wafers and thin wafers, offering excellent cost performance. It can be mounted on any type of robot in our atmospheric environment transport robots. We conduct verification using sample wafers and design to accommodate various sizes, warp amounts, and wafer thicknesses based on the customer's desired shape. The Bernoulli force attracts the workpiece to the substrate. To prevent shifting during transport, guides at the edge limit displacement. It levitates without contact except at the edges. One chuck is designed for one size of wafer. Since the attracting force is due to Bernoulli, it applies force over a wider area than vacuum suction chucks, making it effective for thin wafers. Additionally, it is non-contact on both sides, making it effective for wafers that cannot be contacted.

  • Other semiconductor manufacturing equipment

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